Various techniques for embedding 3D packaging to boost power density. Different methods for cooling chips using 3D packaging. New and emerging technologies for 3D packaging are being deployed at the ...
Relationship of power density and field strength. Some of the more uncommon power-density apps. RF designers frequently need to know the true power density or field intensity at a particular distance ...
The relentless pursuit of higher performance and greater functionality has propelled the semiconductor industry through several transformative eras. The most recent shift is from traditional ...
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