The ubiquitous power-rail decoupling capacitor, located as close to its load as possible, has a thankless role and often gets little respect, as compared to the functions of high-performance analog ...

Researchers have succeeded in developing an all-nitride superconducting qubit using epitaxial growth on a silicon substrate that does not use aluminum as the conductive material. This qubit uses ...

The big picture: Most expect that by the end of the decade, the semiconductor industry will hit a wall in terms of being able to scale transistors on silicon using organic materials. Scaling is key to ...

For many applications, next generation IC packaging is the best path to achieve silicon scaling, functional density, and heterogeneous integration while reducing the overall package size.

Warpage of dies, redistribution layers, and interposers is a growing problem in multi-chiplet packages, and it can have a dramatic impact on the behavior and reliability of these devices. Multiple ...

Warpage is becoming a serious concern in advanced packaging, where a heterogeneous mix of materials can cause uneven stress points during assembly and packaging, and under real workloads in the field.

It has long been acknowledged within the semiconductor industry that energy efficiency and performance are losing pace with advancing demands for computing volume, especially with the meteoric rise of ...