Abstract: With the increase in packaging density of power devices, heat dissipation of power devices has gradually become research hotspots. Among them, the most critical structure that affects the ...
Abstract: A 3-dB adiabatic directional coupler based on dual-layer SOI is innovatively proposed. Our proposed device offers an ultra-broadband of 300 nm and compact footprint of 65 μm, with a 0.19 dB ...
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