Abstract: In this study, the first 3D direct integration of a SiC power MOSFET and its SiC CMOS gate driver is achieved using flip chip bonding, enabling a wire bondless connection. Switching ...
Morley Kert on MSN
Fixing a design flaw with 3D printing
This video addresses a common problem encountered with the Blue Yeti Microphone. **Things Used in This Video:** - Blue Yeti ...
There’s a seemingly unending list of modifications or upgrades you can make to a 3D printer. Most revolve around the mechanical side of things, many are simple prints or small add-ons. This ...
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